What is low pressure injection molding?

What is low pressure injection molding?

It is encapsulation or coating of a circuit board, electrical component, and or part with a low viscosity hot melt resin to provide environmental and physical protection. 

English Name: LPM /Low Pressure Machine (Instantaneous pressure: up to 5Mpa or more)

Ordinary injection molding machine is a screw extrusion type. Its instantaneous pressure and high temperature are enough to destroy the electronic components. The low-pressure injection molding machine uses frequency conversion technology. The injection pump is slowly pressured to supply the glue.  The function of injection molding, sealing and fixing is completed under the temperature control state of the protection circuit (IC) board. The products encapsulated by this process have effect on insulation, flame-retardant, high and low temperature resistance, impact resistance, vibration reduction, dustproof, waterproof, chemical resistance etc.   

The main equipment of low-pressure injection molding process includes: low-pressure injection molding machine, low-pressure tooling, high-performance hot melt adhesive, and corresponding process parameters. Due to the above-mentioned advantages of the low-pressure injection molding process, it is widely used in the packaging and protection of sophisticated and sensitive electronic components. Its application areas include: automotive electronics, medical electronics, IT industry, new energy industry, energy-saving industry and other industries need connectors, sensors, micro switches, wiring harnesses, flexible circuit boards, PCBs and other products.