What is oxygen-free copper (OFC)? 

How is it composed? Why is it better than regular copper?

Oxygen-free copper (OFC) is a highly conductive copper material with extremely high purity and very low oxygen content. It typically contains 99.95%–99.99% pure copper, with the oxygen content controlled below 10 ppm. To achieve this high purity, oxygen-free copper is smelted in a vacuum or hydrogen-protected environment. Hydrogen is used to remove oxygen from the molten copper, and then it is cast and drawn in an oxygen-free environment, resulting in uniform grains within the material and the absence of copper oxide particles. Because this process significantly reduces impurities and minimizes the resistance to electron movement within the copper, oxygen-free copper has superior conductivity compared to regular copper, achieving a conductivity of up to 101% IACS, and exhibiting lower signal loss and heat generation.

Besides its high conductivity, oxygen-free copper also possesses superior oxidation resistance and mechanical strength due to its oxide-free nature. It is less prone to embrittlement or degradation from prolonged electrical contact, making it particularly suitable for high-frequency, high-speed transmission, or high-reliability applications, such as high-speed signal cables for AI servers, precision instruments, automotive high-speed communication cables, and audio cables. In contrast, regular copper or electrolytic copper, with its higher oxygen content, is prone to forming trace oxides, which not only reduces conductivity but may also affect long-term durability.

Simply put, oxygen-free copper is a "high-performance conductor close to pure copper." Through a special oxygen-free smelting process, the material is cleaner and the crystal structure is more complete, resulting in lower impedance, more stable electrical properties, and a longer lifespan. It is the preferred conductor material for high-end wiring harnesses and high-speed signal transmission.